Heat dissipating device

ABSTRACT

The instant disclosure relates to a heat dissipating device capable of mounting on at least one heat conducting pipe. The heat dissipating device includes a heat dissipating fin having a main body. At least one through hole is formed on the main body. At least one set of ribs is formed on the main body and around the through hole. A slot is defined between any two adjacent ribs. The through hole of the main body is for insertion of the heat conducting pipe in allowing the ribs to grip resiliently against the heat conducting pipe. Thus, the heat dissipating device of the instant disclosure enables multiple heat dissipating fins to be stacked on the heat conducting pipe in one run. In saving assembly time, the heat dissipating fins need not be mounted on the heat conducting pipe one piece after another.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The instant disclosure relates to a heat dissipating device; inparticular, to a heat dissipating device which is mountable on a heatconducting pipe and works cooperatively therewith for heat dissipation.

2. Description of Related Art

Along with the enhanced living standard, people are becoming morefastidious about their life quality. Particularly, to the demands ofbetter quality electronic devices and mechanical products are increasingrapidly. Owing to the advanced electrical appliances and technologicalproducts, people are leading a more convenient lifestyle withsignificant changes to their working efficiency. However, this has alsobrought about the issue of researching a stronger power supply andproducts with higher energy-conserving capabilities which are indesperate need of resolutions. Generally, the use of electrical poweroften generates lots of heat during normal operation. If not properlyremoved, such heat can adversely affect the operational stability of theelectrical appliances, resulting in malfunction or damages to themechanical products. Therefore, most of the present electricalappliances are equipped with heat dissipating devices to remove heattherefrom.

Generally, the types of heat dissipating devices are many having varyingstructural designs and providing identical or great diversity offunctional capabilities. And conventional heat dissipating fins have atleast one through hole defined therein, where the heat dissipating finsare mounted on the heat conducting pipes one piece after another.However, the repeating procedure of mounting the heat dissipating finsmay cause deformation to the through holes. Thereby, resulting inunstable mounting of the heat dissipating fins to the heat conductingpipes which further reduces the heat dissipating efficiency.

To address the above issues, the inventor strives via industrialexperience and academic research to present the instant disclosure,which can effectively improve the limitations described above.

SUMMARY OF THE INVENTION

The object of the instant disclosure is to provide a heat dissipatingdevice where the structural design of the heat dissipating fins of theheat dissipating device can avoid deformation of the through holes whenthe heat dissipating fins are mounted on the heat conducting pipes.Furthermore, the concurrent mounting of the heat dissipating fins on theheat conducting pipes can also reduce time consumption to furtherfacilitate the mounting procedure.

A heat dissipating device is provided to mount on at least one heatconducting pipe which has a contacting portion that abuts against a heatgenerating unit. And the surface of the contacting portion in abutmentwith the heat generating unit is substantially a flat surface. The heatdissipating device includes a heat dissipating fin which has a mainbody, where at least one through hole is defined on the main body. Atleast a set of ribs is vertically formed on the main body in atrumpet-like structure around the through hole, where a slot is definedbetween every two adjacent ribs. The heat dissipating fin further has astacking portion defined by at least one rectangular via hole formed onthe base and at least one ridge formed adjacently to via hole. At leastone heat conducting pipe is inserted into the through hole of the heatdissipating fin with the ribs gripping resiliently against the pipe.

A heat dissipating device is further provided to mount on at least oneheat conducting pipe which has a contacting portion that abuts against aheat generating unit. And the surface of the contacting portion inabutment with the heat generating unit is substantially a flat surface.The heat dissipating device includes a plurality of stacked heatdissipating fins. Each of the heat dissipating fins has a main body,where at least one through hole is defined on the main body. At least aset of ribs is vertically formed on the main body in a trumpet-likestructure around the through hole, where a slot is defined between everytwo adjacent ribs. The heat dissipating fin further has a stackingportion defined by at least one rectangular via hole formed on the mainbody and at least one ridge formed adjacently to the via hole. Notably,the heat dissipating fins are arranged in parallel to each other and atleast one heat conducting pipe is inserted into the through holes of theheat dissipating fins with the ribs gripping resiliently against thepipe. The stacking portion of each of the heat dissipating fins abutsagainst the stacking portion of the adjacent heat dissipating fin.

Based on the above, the instant disclosure has the following advantages:

The heat dissipating fins of the instant disclosure can be attached toand stacked along the heat conducting pipes through a single processwhich reduces a vast amount of time and cost spend in the stackingprocedure. The heat dissipating fins are also prevented from bending oreven deforming during the process. A distance is kept between every twoadjacent heat dissipating fins during stacking to dissipate heat. Thestacking portions of the heat dissipating fins in the instant disclosurehelp to provide structural stability for the heat dissipating fins whenstacked and reduce the material cost.

In order to further appreciate the characteristics and technicalcontents of the instant disclosure, references are hereunder made to thedetailed descriptions and appended drawings in connection with theinstant disclosure. However, the appended drawings are merely shown forexemplary purposes, rather than being used to restrict the scope of theinstant disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a perspective view of a heat dissipating device for anembodiment according to the instant disclosure.

FIG. 2 shows a perspective view of a heat dissipating device for anotherembodiment according to the instant disclosure.

FIG. 3 shows an assembled view of the heat dissipating device of theinstant disclosure mounted to the heat conducting pipes.

FIG. 4 shows another assembled view of the heat dissipating device ofthe instant disclosure in FIG. 3.

FIGS. 5-7 show the assembling steps of the base and the cover plate tothe heat conducting pipes.

FIG. 8 shows a partially amplified view of the heat dissipating deviceaccording to the instant disclosure;

FIG. 9 shows a perspective view of yet another heat dissipating deviceaccording to the instant disclosure.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The First Embodiment

Please refer to FIGS. 1-8. A heat dissipating device is provided by theinstant disclosure. For in use, the heat dissipating device of theinstant disclosure dissipates heat produced from a heat generating unit5, where the heat generating unit 5 may be, but not limited to, acentral processing unit (CPU) or other electronic devices, etc.Furthermore, the heat dissipating device is adaptable with three heatconducting pipes 3, where each of the heat conducting pipes 3 has acontacting portion 31.

Referring to FIG. 1, the heat dissipating device includes a plurality aheat dissipating fins 4 stacked on top of each other. Each of the heatdissipating fins 4 has a sheet-like shape and a main body 41, threethrough holes 42 formed on the main body 41, three sets of ribs 43vertically formed on the main body 41 each forming a trumpet-likestructure, a stacking portion 44 formed on the main body 1, and a bentportion 45 formed on the main body 1. For the instant embodiment, thenumber of through holes 42 on the main body 41 is equal to the number ofheat conducting pipes 3. In other words, the quantity of each of theserespective components is three. An enlarged view to illustrate thestructural features of the heat dissipating fin 4 is shown in FIG. 2.

Please refer to FIGS. 3-4. The through holes 42 allow the heatconducting pipes 3 to slide through the heat dissipating fins 4. And theribs 43 are vertically formed on the main body 41 around each throughhole 42.

Each set of ribs 43 is defined by a plurality of slots 431. Namely,every two adjacent ribs 43 are separated by the corresponding slot 431to increase the flexibility of each rib 43. Thereby, each set of ribs 43is capable of pressing elastically against the respective heatconducting pipe 3. When the heat dissipating fins 4 are fitted on theheat conducting pipes 3, the flexible ribs 43 prevent the through holes42 from deforming due to repeated disassembly and reassembly. Each ofthe heat dissipating fins 4 are enabled to grip tightly against the heatconducting pipes 3 to increase the heat dissipating efficiency.

For the instant embodiment, the stacking portion 44 is defined by sixrectangular via holes 441 and six ribs 442 formed respectively in anadjacent manner on the main body 41. However, the structural design ofthe stacking portion 44 is not restricted thereto. For the instantembodiment, two via holes 441 are formed around each through hole 42oppositely, and the ribs 442 are formed bendingly adjacent to respectivevia holes 441 in a vertically protruding manner on the main body 41.

Thereby, the ribs 442 of the stacking portion 44 of each of the heatdissipating fins 4 abut against the ribs 442 of the adjacent heatdissipating fins 4. Thus, a spacing is formed between any two adjacentheat dissipating fins 4.

The bent portion 45 is defined by four tabs 451 arranged on theperiphery of the main body 41. For the instant embodiment, four tabs 451for provided. The bent portion 45 is formed by bending the protrusions(not shown) formed on the periphery of the main body 41 in a rightangled manner. Thereby, the bent portion 45 of one of the heatconducting fin 4 will abut against the bent portion 45 of the adjacentheat conducting fin 4, where the physical nature of the bent portion 45is not restricted.

Please refer to FIGS. 5-7. The heat dissipating device may furtherinclude a base 1 and a cover plate 2, where both components can be madeof metallic materials. The base 1 has a supporting portion 11 and afastening portion 12. The supporting portion 11 is a plate-likestructure having an opening 112 formed thereon, while the fasteningportion 12 is formed extendingly from the supporting portion 11.Furthermore, the fastening portion 12 has, but not limited to, fourprotrusions 121. Two ramps 111 are formed oppositely on the supportingportion 11 adjacent to the opening 112. For the instant embodiment,there are two ramps 111. In addition, the physical nature of the base 1is not restricted.

The cover plate 2 is a plate-like structure which corresponds to thestructural design of the base 1. The cover plate 2 has a restrictingportion 21 defined by four restricting notches 211 concavely formed onthe periphery of the cover plate 2. For the instant embodiment, thereare, but not limited to, four restricting notches 211 available. Therestricting notches 211 are engaged by the protrusions 121 of thefastening portion 12 accordingly.

Please refer to FIG. 8. The contacting portions 31 of the heatconducting pipes 3 are arranged in parallel within the opening 112 ofthe supporting portion 11. More specifically, the contacting portions 31abut against the sidewalls that define the opening 112 of the supportingportion 11. The surface of each contacting portion 31 touching the heatgenerating unit 5 is substantially a flat surface to achieve an enhancedheat dissipating effect. Furthermore, the physical nature of the heatconducting pipes 3 is not restricted.

The Second Embodiment

Please refer to FIG. 9 which shows a second embodiment of the instantdisclosure. For the instant embodiment, at least one engaging member 46is provided on each heat dissipating fin 4 in replacing the bent portion45 of the previous embodiment. More specific descriptions will beprovided hereinbelow.

The engaging member 46 includes an engaging body 461 and an engagingslot 462. The engaging body 461 is formed by stamping and kinking of themain body 41 to reduce the consumption of materials. The engaging slot462 is formed accordingly by the engaging body 461. The engaging body461 of one heat dissipating fin 4 is engaged to the engaging slot 462 ofadjacent heat dissipating fin 4 to maintain the stacked heat dissipatingfins 4 in proper alignment with each other. Furthermore, the structuraldesign of the engaging member 46 is not restricted.

Based on the above, a plurality of the heat dissipating fins 4 of theinstant embodiment can be attached to and stacked along the heatconducting pipes 3 concurrently. Therefore, the heat dissipating fins 4need not be mounted on the heat conducting pipes 3 one piece afteranother to reduce time consumption. Furthermore, the base 1 and thecover plate 2 are connectively designed to fasten the three heatconducting pipes 3 therebetween without the utilization of glue andsolder paste to reduce cost. The heat conducting pipes 3, moreover, aredisposed on the heat generating unit 5 where the surface in contacttherewith is substantially a flat surface. Thereby, increasing the heatdissipating efficiency of the heat dissipating device.

The descriptions illustrated supra set forth simply the preferredembodiments of the instant disclosure; however, the characteristics ofthe instant disclosure are by no means restricted thereto. All changes,alternations, or modifications conveniently considered by those skilledin the art are deemed to be encompassed within the scope of the instantdisclosure delineated by the following claims.

What is claimed is:
 1. A heat dissipating device, for mounting on atleast one heat conducting pipe having a contacting portion abutting aheat generating unit, wherein a surface of the contacting portion inabutment with the heat generating unit is substantially a flat surface,comprising: a heat dissipating fin, comprising: a main body having atleast one through hole formed thereon; at least a set of ribs verticallyformed on the main body and around the through hole, wherein a slot isdefined between every two adjacent ribs; a stacking portion defined byat least one rectangular-shaped via hole formed on the main body and aridge vertically formed adjacent to the via hole; wherein the throughhole of the heat dissipating fin is for insertion of the heat conductingpipe and allow the ribs to grip resiliently therewith.
 2. The heatdissipating device according to claim 1, wherein multiple through holesare formed on the main body in correspondence to the equal number ofheat conducting pipes, and wherein the heat conducting pipes arearranged in parallel and penetrate the through holes.
 3. The heatdissipating device according to claim 1, wherein the heat dissipatingfin has a bent portion defined by a plurality of tabs arranged on theperiphery of the main body.
 4. The heat dissipating device according toclaim 1, wherein the heat dissipating fin has at least one engagingmember, wherein the engaging member has an engaging body in defining anengaging slot, and wherein the engaging body is formed by stamping andkinking of the main body.
 5. The heat dissipating device according toclaim 1, further comprising a base and a cover plate, wherein the basehas a supporting portion and a fastening portion, wherein an opening isdefined on the supporting portion, while the fastening portion isextended from the supporting portion, wherein the cover plate has arestricting portion for mounting to the fastening portion, and whereinthe contacting portion of the heat conducting pipe is arranged betweenthe base and the cover plate.
 6. The heat dissipating device accordingto claim 5, wherein the supporting portion includes at least one ramparranged adjoining the opening and in the axial direction of thecontacting portion of the heat conducting pipe.
 7. The heat dissipatingdevice according to claim 6, wherein the heat conducting pipe abuts theramp of the supporting portion.
 8. The heat dissipating device accordingto claim 5, wherein the fastening portion of the base has at least oneprotrusion, and the restricting portion of the cover plate is defined byat least one restricting notch, wherein the protrusion of the base isengaged to the restricting notch of the cover plate.
 9. The heatdissipating device according to claim 8, wherein the restricting notchis formed concavely on the periphery of the cover plate.
 10. The heatdissipating device according to claim 5, wherein the contacting portionsof multiple heat conducting pipes are arranged in parallel in theopening of the supporting portion and abutting the sidewalls of theopening.
 11. A heat dissipating device, for mounting on at least oneheat conducting pipe having a contacting portion abutting a heatgenerating unit, wherein a surface of the contacting portion in abutmentwith the heat generating unit is substantially a flat surface,comprising: a set of heat dissipating fins including a plurality ofstacked heat dissipating fins, wherein each heat dissipating fin has: amain body having at least one through hole formed thereon; at least aset of ribs vertically formed on the main body and around the throughhole, wherein a slot is defined between every two adjacent ribs; astacking portion defined by at least one rectangular-shaped via holeformed on the main body and a ridge formed on the main body adjacent tothe via hole; wherein the heat dissipating fins are parallelly mountedon the heat conducting pipe by the respective through holes, with theribs of the heat dissipating fins griping resiliently on the heatconducting pipe, wherein the stacking portions between adjacent heatdissipating fins abut against one another.
 12. The heat dissipatingdevice according to claim 11, wherein each of the heat dissipating finshas a bent portion defined by a plurality of extensions formed on theperiphery of the main body, and wherein the bent portions betweenadjacent heat dissipating fins abut against one another.
 13. The heatdissipating device according to claim 11, wherein each of the heatdissipating fins has at least one engaging member, wherein the engagingmember has an engaging body in defining an engaging slot, and whereinthe engaging body is formed by stamping and kinking of the main body.14. The heat dissipating device according to claim 13, wherein for thestacked heat dissipating fin, the engaging slot of each heat dissipatingfin is engaged by the engaging body of the adjacent heat dissipatingfin.
 15. The heat dissipating device according to claim 11, furthercomprising a base and a cover plate, wherein the base has a supportingportion and a fastening portion, wherein an opening is defined on thesupporting portion, and the fastening portion is extended from thesupporting portion, wherein the cover plate has a restricting portionfor mounting to the fastening portion, and wherein the contactingportion of the heat conducting pipe is arranged between the base andcover plate.
 16. The heat dissipating device according to claim 15,wherein the supporting portion has at least one ramp arranged adjoiningthe opening and in the axial direction of the contacting portion of theheat conducting pipe, and wherein the heat conducting pipe abuts theramp.
 17. The heat dissipating device according to claim 15, wherein thecover plate is fixed to the base.
 18. The heat dissipating deviceaccording to claim 17, wherein the fastening portion of the baseincludes at least one protrusion and the restricting portion of thecover plate is defined by at least one restricting notch for engagingthe protrusion.
 19. The heat dissipating device according to claim 18,wherein the restricting notch is formed concavely on the periphery ofthe cover plate.
 20. The heat dissipating device according to claim 15,wherein the contacting portions of multiple heat conducting pipes arearranged in parallel in the opening and abut the sidewalls of theopening.